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Cooler and energy-efficient chips
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Spray cooling
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gif »  Hybrid nanoscale chips
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spacer Precise spray cooling with inkjet heads.    
     
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Overview

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We're looking for ways to more efficiently cool chips and reduce energy consumption by matching computing tasks to the chips that require the least amount of power for performance. We've also figured out how to produce hybrid nanoscale chips that use less energy and provide up to eight times the density at lower cost.

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Cooling chips with inkjet technology

 

As microprocessor power density grows and new chip packaging solutions such as 3D stacked chips become prevalent, managing the heat they generate becomes increasingly difficult.

Existing solutions to chip cooling either lack the ability to remove enough heat – risking temperatures too high to allow effective and reliable operation – or they lack the ability to precisely target hot spots. As multi-core technologies proliferate, this capability is increasingly required.

HP researchers found a solution in HP’s thermal inkjet heads, which spray ink from hundreds of tiny nozzles. Each nozzle can be individually controlled, determining both how much ink is dispensed and where it lands on the page.

By reconfiguring inkjet heads to spray tiny droplets of liquid coolant instead of ink, researchers were able to locally distribute cooling fluid on a microprocessor die. Using this technology, they demonstrated heat transfer rates of over 4000 W/cm2, which is significantly higher than all other methods.

HP Labs has an ongoing research collaboration with Santa Clara University to explore the fundamentals of this technology.

 
Spray cooling
 
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Choosing the right tools for the job

 
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spacer Matching the application to the core that provides the best performance for the least amount of energy. spacer
 
 
Different cores offer different levels of speed and performance. Our pioneering asymmetric microprocessor core architecture combines cores with different capabilities and performance in multi-core processors to address the issues of power consumption and heat generation in future processors.

By intelligently matching diverse workloads to the core types that performed tasks with the minimum energy (and turning other cores off), researchers showed that energy consumption could be reduced by 50 percent for conventional user applications. They also found that the same approach could be used with asymmetric servers in a blade enclosure with similar benefits.

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