HP-PAC: A New Chassis and Housing Concept for Electronic Equipment
HP-PAC replaces the familiar metal chassis structure with expanded polypropylene (EPP) foam. Large reductions are realized in mechanical parts, screw joints, assembly time, disassembly time, transport packaging, and housing development costs.
by Johannes Mahn, Jurgen Haberle, Siegfried Kopp, and Tim Schwegler
Article 2 - aug94a2.pdf
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