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December 1996, Article 6

Radially Staggered Bonding Technology

This new approach to fine-pitch integrated circuit bonding entails a new configuration of bonding pads on the die, dual-loop wire bonding, and a new leadframe design that minimizes wire lengths. The approach bypasses the usual obstacles to fine-pitch bonding that arise with the conventional in-line approach, thus providing appreciable die size and cost reductions with a minimal assembly cost penalty.

by Rajendra D. Pendse, Rita N. Horner, and Fan Kee Loh


Article 6 - dec96a6.pdf


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