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Paper Named Best at InterPACK '03

Work Explores Using HP's Inkjet Technology to Cool Chips

July 2003
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A paper by HP Labs researchers on their groundbreaking microprocessor-cooling technique has been named "best paper" at the InterPACK '03, the world's premier conference on packaging microelectronics, photonics, and microwave and microelectromechanical systems.

"Inkjet-Assisted Spray Cooling of Electronics" explores the problems of existing electronics-cooling methods and explains how researchers used HP's classic inkjet technology to attack the growing problem of heat generation in powerful microprocessors.

In their paper, authors Cullen E. Bash, Chandrakant D. Patel and Ratnesh K. Sharma, discuss how the inkjet head's ability to target spray cooling allows it to cool chips even when temperature and heat flux levels vary across surfaces.

The paper was one of three presented by HP Labs researchers at the conference. Monem Beitelmal and Rich Friedrich joined Patel, Bash, Sharma as authors of "Smart Cooling of Data Centers," which examines work to dynamic smart cooling. Dynamic smart cooling would allocate cooling resources based on the demands placed by computing workloads.

In addition, Bash and Rocky Shih (of HP Global Operations) collaborated on "Dynamic Characterization of Thermal Interface Material for Electronic Cooling," which discusses the design and construction of an automated thermal interface material (TIM) test system based on the industry-standard test method. TIM manufacturers typically use a variation of the industrial standard ASTM D5470 test method, and subsequently provide data that is difficult for the end user to effectively utilize for product development.

InterPACK '03, the PACIFIC RIM/ASME International Electronic Packaging Technical Conference & Exhibition, was held July 6-11 in Maui, Hawaii, USA.

by Jamie Beckett


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