A paper by HP Labs researchers on their groundbreaking microprocessor-cooling
technique has been named "best paper" at the InterPACK
'03, the world's premier conference on packaging microelectronics,
photonics, and microwave and microelectromechanical systems.
"Inkjet-Assisted Spray Cooling of Electronics"
explores the problems of existing electronics-cooling methods
and explains how researchers used HP's classic inkjet technology
to attack the growing problem of heat generation in powerful
In their paper, authors Cullen E. Bash, Chandrakant D. Patel
and Ratnesh K. Sharma, discuss how the inkjet head's ability
to target spray cooling allows it to cool chips even when
temperature and heat flux levels vary across surfaces.
The paper was one of three presented by HP Labs researchers
at the conference. Monem Beitelmal and Rich Friedrich joined
Patel, Bash, Sharma as authors of "Smart Cooling of Data
Centers," which examines work to dynamic smart cooling.
Dynamic smart cooling would allocate cooling resources based
on the demands placed by computing workloads.
In addition, Bash and Rocky Shih (of HP Global Operations)
collaborated on "Dynamic Characterization of Thermal
Interface Material for Electronic Cooling," which discusses
the design and construction of an automated thermal interface
material (TIM) test system based on the industry-standard
test method. TIM manufacturers typically use a variation of
the industrial standard ASTM D5470 test method, and subsequently
provide data that is difficult for the end user to effectively
utilize for product development.
InterPACK '03, the PACIFIC RIM/ASME International Electronic
Packaging Technical Conference & Exhibition, was held
July 6-11 in Maui, Hawaii, USA.
by Jamie Beckett