design and performance evaluation of a compact thermosyphon
Proceedings of the International Conference Thermes 2002, Santa Fe,
New Mexico, 13-16 January 2002.
© Milllpress Science Publishers, Rotterdam,
Netherlands, 2002
Monem H. Beitelmal and Chandrakant D. Patel of HP Labs; Aniruddha
Pal and Yogendra Joshi of Georgia Institute of Technology and Todd
Wenger of Thermacore International
Thermosyphons have great potential for cooling high heat dissipating
electronics. This paper presents the implementation of a compact
thermosyphon for cooling of a Pentium 4 microprocessor in a Hewlett-Packard
Vectra PC.
Read the full paper here. Requires
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Acrobat.
more about the HP Labs authors:
Chandrakant D. Patel is a principal scientist in charge of electronics cooling research
at HP Labs. He established the thermal technology research program
at HP Labs in 1995 and is responsible for strategically engaging
in research of cooling technologies for future HP microprocessors,
workstations and servers.
Between 1991 and 1995, he worked on the VLIW (Very Long Instruction
Word) program, and was responsible for the development of the thermo-mechanical
solution for the VLIW microprocessor. The VLIW work became the basis
for Intel's next-generation Itanium architecture. He has been granted
seven U.S. patents in thermo-mechanical design of microprocessors
and systems.
Monem H. Beitelmal is a Member of the Technical Staff at
Hewlett-Packard Laboratories. He joined HP Labs as a research intern
in 1996 and he became a full-time researcher in 2000. His area of
expertise is in heat transfer and fluid dynamics. He was involved
with several research projects as they relate to electronics cooling
such as air jet impingement for heat transfer, sub-cooling and thermal
management using rankine vapor compression cycle and two-phase thermosyphon
technology. He is currently involved with the utility data center
research project.
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