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design and performance evaluation of a compact thermosyphon

Proceedings of the International Conference Thermes 2002, Santa Fe, New Mexico, 13-16 January 2002.

Milllpress Science Publishers, Rotterdam, Netherlands, 2002

Monem H. Beitelmal and Chandrakant D. Patel of HP Labs; Aniruddha Pal and Yogendra Joshi of Georgia Institute of Technology and Todd Wenger of Thermacore International

Thermosyphons have great potential for cooling high heat dissipating electronics. This paper presents the implementation of a compact thermosyphon for cooling of a Pentium 4 microprocessor in a Hewlett-Packard Vectra PC.
Read the full paper here. Requires Adobe Acrobat.

more about the HP Labs authors:

Chandrakant D. Patel is a principal scientist in charge of electronics cooling research at HP Labs. He established the thermal technology research program at HP Labs in 1995 and is responsible for strategically engaging in research of cooling technologies for future HP microprocessors, workstations and servers.

Between 1991 and 1995, he worked on the VLIW (Very Long Instruction Word) program, and was responsible for the development of the thermo-mechanical solution for the VLIW microprocessor. The VLIW work became the basis for Intel's next-generation Itanium architecture. He has been granted seven U.S. patents in thermo-mechanical design of microprocessors and systems.

Monem H. Beitelmal is a Member of the Technical Staff at Hewlett-Packard Laboratories. He joined HP Labs as a research intern in 1996 and he became a full-time researcher in 2000. His area of expertise is in heat transfer and fluid dynamics. He was involved with several research projects as they relate to electronics cooling such as air jet impingement for heat transfer, sub-cooling and thermal management using rankine vapor compression cycle and two-phase thermosyphon technology. He is currently involved with the utility data center research project.


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