Computational Fluid Dynamics Modeling of High Compute Density
Data Centers to Assure System Inlet Air Specifications
Reprinted from the proceedings of the Pacific Rim ASME International
Electronic Packaging Technical Conference and Exhibition (IPACK
© 2001, ASME
Chandrakant D. Patel, Cullen E. Bash and Christian Belady of HP
and Lennart Stahl and Danny Sullivan of Emerson Energy Systems
Due to high heat loads, designing the air conditioning system in
a data center using simple energy balance is no longer adequate.
Data center design cannot rely on intuitive design of air distribution.
It is necessary to model the air flow and temperature distribution
in a data center. This paper presents a computational fluid dynamics
model of a
prototype data center to make the case for such modeling.
Read the full paper here. Requires
About the Authors:
Chandrakant D. Patel is a principal scientist in charge
of electronics cooling research at HP Labs. He established the thermal
technology research program at HP Labs in 1995 and is responsible
for strategically engaging in research of cooling technologies for
future HP microprocessors, workstations and servers.
Between 1991 and 1995, he worked on the VLIW (Very Long Instruction
Word) program, and was responsible for the development of the thermo-mechanical
solution for the VLIW microprocessor. The VLIW work became the basis
for Intel's next-generation Itanium architecture. He has been granted
seven U.S. patents in thermo-mechanical design of microprocessors
Cullen E. Bash is a member of the technical staff at HP
Labs. He joined the Thermo-Mechanical Architecture group in 1998
and is involved with thermal modeling, metrology and cooling technology
research in scales ranging from microprocessors to rooms. Prior
to joining HP Labs, he worked on the thermo-mechanical design of
various HP servers and PA-RISC microprocessor modules. He holds
two U.S. patents related to electronics cooling.
Christian Belady is a principal scientist for HP's High
Performance Systems Lab in Richardson, Texas and is responsible
for the power and cooling design and strategy of the center's high-end
computers. In addition, he is responsible for identifying and developing
key technologies for future products. His latest interests focus
on power consumption of computers and their impact on facility and
Christian has received the IMAPS 1999 William D. Ashman Achievement
Award as well as the North Texas 1998-99 Mechanical Engineer of
the Year Award. He is also a Fellow and Lifetime Member of the International
Microelectronics and Packaging Society (IMAPS). He holds six U.S.