HP Labs Technical Reports



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A Precision Vertical Interconnect Technology

Greenstein, Michael; Matta, Farrid

HPL-90-07

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Abstract: An interconnection technology is described that utilizes excimer laser drilled vias and computer controlled plating to provide vertical (Z-axis) electrical connections in high performance flexible circuits. Specifically, solid vias and hemispherical micro-contacts are created with a 1 um nearest neighbor height precision for the micro-contacts. A novel structural architecture is employed which simplifies the ground plane connections for impedance controlled flex circuits. The technology is particularly suitable in the DC to 2 GHz frequency range, where large numbers of parallel connections and or multiple make and break connections are desirable. This technology was implemented with a polyimide substrate and nickel contacts, although the technology is applicable to other substrate and contact metallurgies.

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