HP Labs Technical Reports

Modeling and Analysis of High Speed VLSI Interconnects for Digital Applications

Barber, Alan; Lee, Ken

HPL-92-3

Keyword(s):

Abstract: Increasing speed and density of VLSI technologies place increasing demands on packaging and interconnection structures to support them. We describe here a methodology for simulating the performance of electrical interconnects using SPICE and describe a library of models to suppport it. We then use this methodology to examine how the physical design choices of materials and dimensions affect the electrical results of crosstalk, ground bounce and reflections and, ultimately, noise margin. Real design examples are examined and issues relevant to sub-nanosecond signaling explored.

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