HP Labs Technical Reports
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Assessing and Characterizing Inter- and Intra-die Variation Using a Statistical Metrology Framework: A CMP Case Study
Divecha, R.; Stine, B.; Chang, E.; Ouma, D.; Boning, D.; Chung, J.; Nakagawa, O.S.; Oh, S.; Prasad, S.; Kapoor, A.
Keyword(s):chemical-mechanical polishing, sta
Abstract: A statistical metrology methodology has been developed and used to study the contributions to spatial variation in ILD thickness remaining after chemical-mechanical polishing. New elements of statistical metrology are described, including a three-phase experimental approach and the use of a modified repeated measure analysis of variance technique.
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