Optimization of Interconnect Geometry for High-Performance Microprocessors
The goals of the work presented in this paper were to estimate quantitatively the impact of interconnect technology parameters on the performance of high-end microprocessors and to use this information to optimize the interconnect geometry within the constraints imposed by the process. The 64-bit PA 8000 microprocessor was used as a test case.
by Khalid Rahmat and Soo-Young Oh
Article 13 - apr97a13.pdf
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