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August 1998, Article 9

August 1998, Article 9

Engineering Surfaces in Ceramic Pin Grid Array Packaging to Inhibit Epoxy Bleeding

Bleeding of epoxy resin around surfaces undergoing bonding during electronic packaging assembly has long caused sporadic yield loss. Previously, it was thought that vacuum baking reduced the yield loss resulting from surface contaminants. Although vacuum baking inhibits epoxy resin bleeding, it also produces coatings of hydrocarbons, which affect surface wettability and surface energy. Surfactant coating results in a surface chemistry similar to vacuum-baked substrates but is a better alternative because of its controllability.

by Ningxia Tan, Kenneth H. H. Lim, Bernard Chin, and Anthony J. Bourdillon

Article 9 - aug98a9.pdf

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