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table of contents

August 1998,
Volume 49, Issue 3


A 150-MHz-Bandwidth Membrane Hydrophone for Acoustic Field Characterization
by Paul Lum, Michael Greenstein, Edward D. Verdonk, Charles Grossman, Jr., and Thomas L. Szabo
Units, Traceability, and Calibration of Optical Instruments
by Andreas Gerster
Techniques for Higher-Performance Boolean Equivalence Verification
by Harry D. Foster
On-Chip Cross Talk Noise Model for Deep-Submicrometer ULSI Interconnect
by Samuel O. Nakagawa, Dennis M. Sylvester, John G. McBride, and Soo-Young Oh
Theory and Design of CMOS HSTL I/O Pads
by Gerald L. Esch, Jr. and Robert B. Manley
A Low-Cost RF Multichip Module Packaging Family
by Lewis R. Dove, Martin L. Guth, and Dean B. Nicholson
Testing with the HP 9490 Mixed-Signal LSI Tester
by Matthew M. Borg and Kalwant Singh
Reliability Enhancement of Surface Mount Light-Emitting Diodes for Automotive Applications
by Koay Ban-Kuan, Leong Ak-Wing, Tan Boon-Chun, and Yoong Tze-Kwan
Engineering Surfaces in Ceramic Pin Grid Array Packaging to Inhibit Epoxy Bleeding
by Ningxia Tan, Kenneth H. H. Lim, Bernard Chin, and Anthony J. Bourdillon

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