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Two-Phase Loop: Compact Thermosyphon

Beitelmal, Monem H.; Patel, Chandrakant D.

HPL-2002-6

Keyword(s): liquid loop; thermosyphon; passive cooling loop

Abstract: Power density of future microprocessors is projected to reach over 100 W/cm(superscripted 2). Shrinking system size, the need to integrate more components within limited space, and customer demand to reduce system acoustic noise present significant challenges to the thermal designer. Thermosyphon technology provides a promising solution to these thermal challenges. Conventional heat sink capability to overcome the new thermal challenges is limited. Refrigeration and spray cooling can provide a solution to the thermal challenges posed by the higher power density, however reliability issues are still unresolved making these solutions impractical for the current challenges. Loop thermosyphon provides the benefits of using liquid cooling for microprocessor. It is a two-phase passive cooling loop that uses liquid as a working fluid. The loop between the evaporator and the condenser results in separate vapor and condensate path. It is considered to be a compact thermal management device due to its flexibility in size and cooling capacity range. This report presents HP Laboratories loop thermosyphon prototype and the experimental results of its thermal performance.

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