Surface Deformation and Defect Reduction in Annealed Epitaxial Germanium
Share- Author(s): Cho, Hans S.; Zhang, Jiaming; Kamins, Theodore I.
- HP Laboratories
- HPL-2015-27
Abstract: Epitaxial germanium (epi-Ge) on Si is an ideal material for transistor and optoelectronic devices such as photodetectors due to its higher carrier mobility compared to Si, and its compatibility with existing Si-based processes. However, epi-Ge suffers from surface roughness and crystal defects such as dislocations due to its 4% lattice mismatch with Si. The wide adoption of epi Ge-based devices will depend in a significant part on successfully growing smooth Ge films - or functional structures - directly onto Si substrates with a low defect density. Previous studies have shown that defects in hetero-epitaxial Ge on Si can be removed by annealing in an H2 ambient, or by selective epitaxy and defect-necking through a high- aspect-ratio aperture etched through an SiO2 mask. Given the efficacy of either method, it would be logical to investigate processes utilizing elements of both methods. In this study, we demonstrate two examples of three-dimensionally shaped epi-Ge structures upon which post-growth annealing was applied, resulting in clear alteration of the surface morphology and reduction in defect density. In the first example, high-aspect-ratio holes were etched into a thick layer of epi-Ge on Si (Fig.1), then annealed at 850oC in a hydrogen atmosphere, resulting in topological changes that closed the hole openings and yielded a continuous Ge film on the surface and smooth nanocavities below the surface (Fig.2). In the second, mesa-like structures of epi-Ge were selectively grown through patterned openings in a thermal silicon dioxide layer, then annealed at temperatures above 700oC in a hydrogen atmosphere. Whereas the as-grown mesas were rough with crystalline growth facets or morphological non-uniformities related to the selective epitaxy conditions, and contained multiple growth defects such as stacking faults and twins (see Fig.3), the post-annealed structures were smooth and rounded, and showed a drastic decrease in defect density (Fig.4). The post- annealed microstructural and morphological changes observed in both cases are attributed to bulk and surface diffusion and rearrangement of Ge atoms according to the Gibbs-Thomson effect, by which local surface energy is minimized.
2 Pages
- External Posting Date: External Posting Date: April 6, 2015 [Abstract Only]. Approved for External Publication - External Copyright Consideration
- Internal Posting Date: Internal Posting Date: April 6, 2015 [Fulltext]