HP Labs Technical Reports



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Modeling and Analysis of Multichip Module Power Supply Planes

Lee, Ken; Barber, Alan

HPL-94-32

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Abstract: A method that would allow accurate modeling of arbitrarily shaped planes with bypass capacitors has been developed. It is compatible with a SPICE based modeling nethod for the rest of the power supply hierarchy and the devices. A modified SPICE is used to accommodate distributed circuits. The distributed circuits are built with microwave analysis software and connected to SPICE by s-parameter files. The modeling process is described and examples of thick and thin film power supply planes are presented with comparison to measured results. The method is used to explore potential design choices for a large MCM with many simultaneously switching drivers.

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